加载中…焊接相关的英语术语
(2016-05-04 20:35:20)
标签：
英语smt术语焊接英语术语虚焊 |
以下是我自己搜集汇总的，如有错误，还望指正！
false soldering
"假焊"
poor
soldering（个人建议）“虚焊”=焊接得不够牢固不够好
cold
solder
"冷焊"
poor-wetting
"润湿不良"
insufficient solder
"少錫"
open
solder
"开路"
unsoldering
拆焊
假焊是指焊点表面上好像焊接成功，但实际上并没有焊住，有时用手一拨，引线就可以从焊接点中拨出。关键字：没有焊住。
虚焊是焊点处只有少量的锡焊柱，造成接触不良，时通时断。关键字：接触不良。
可以理解为：假焊实际是没有焊上去，器件不能使用，而虚焊是焊接的不牢靠，会出现接触不良时好时坏的情况。
补充一些：
空焊是焊点应焊而未焊。锡膏太少、零件本身问题、置件位置、印锡后放置时间过长等会造成空焊。关键字：空的。
冷焊是在零件的吃锡接口没有形成吃锡带，（即焊锡不良）。流焊温度太低、流焊时间太短、吃锡性问题等会造成冷焊。关键字：温度不够，“冷”嘛！
“虚焊”的英语表达：I support the answer "poor
soldering", "cold soldering" should be another defect mode. I think
"cold soldering" should be caused by low peak temperature or short
reflow time, the solder paste doesn't melt well at peak
temperature. but " poor soldering" is mainly cuased by oxidation.
the surface ot the component termination or PCB is oxidized, so
although the solder paste is melt, but the flux is not enough to
remove the oxid. ---但本编辑认为poor soldering其实还是可以的。
本编辑个人认为， inveracious
soldering 不妥，因为 inveracious
有感情色彩，欺骗性质的虚假的焊接。但实际上用poor即可表达焊接得不好。
common soldering problems：
Cold Joint 冷焊点 （焊料没有完全融化；Cold joints
can usually be repaired by simply re-heating the joint with a hot
iron until the solder flows. A properly pre-heated soldering iron
with sufficient power will help prevent cold joints.）（ If all metal
surfaces are not properly fluxed and brought above the melting
temperature of the solder in use, the result will be an unreliable
"cold solder joint".）
Disturbed Joint 受扰焊点
solder bond 焊接接缝
crack 裂缝、裂纹
stress cracks 应力开裂/裂纹
excess solder 包焊、焊锡过多
solder starved joint 少锡焊点 （A solder
starved joint simply does not have enough solder.）
Overheated Joint 过热焊点 （The solder has
not yet flowed well and the residue of burnt flux will make fixing
this joint difficult. An overheated joint can usually be repaired
after cleaning.）
Insufficient Wetting 润湿不足
solder pad 焊接盘
Insufficient Wetting (Pin)（This
solder in this joint has not wetted the pin at all and has only
partially wetted the pad. In this case, heat was not applied to the
pin and the solder was not given adequate time to flow.）
Insufficient Wetting (Pad)（The solder
has wetted the leads nicely, but it has not formed a good bond with
the pad. This can be caused by a dirty circuit board, or by failing
to apply heat to the pad as well as the pin.）
surface mount component
表面贴装元件
through-hole mounted component
通孔安装元件
Untrimmed Leads 未修理的
Solder Bridge 焊桥（Two solder joints
have melted together, forming an unintended connection between the
two. Sometimes the excess solder can be drawn off by dragging the
tip of a hot iron between the two solder joints. If there is too
much solder, a solder sucker or solder wick can help get rid of the
excess.）
solder sucker 吸焊器
Lifted Pad 焊点剥离，拔尖
void 空焊 （In the joining of copper
tube, failure to properly heat and fill a joint may lead to a
'void' being formed.）
through-plating 穿孔电镀
burnt flux
烧结焊剂
fine-pitch soldering 精密间距焊接
flux 焊剂 助焊剂
wetting 浸润
heat transfer 热传递
pre-tinned
预镀锡
（Plastic or metal）mounting clip
装配夹
holders 支持物
heat sink 散热片？吸热件
A heat sink may be used on the leads
of heat sensitive components to reduce heat transfer to the
component. (Note the heat sink will mean the use of more heat to
complete the joint.)
soldering iron
焊铁，烙铁
solder 焊料
solder wire 焊丝
solder icicle 锡尖
To simplify soldering, beginners are
usually advised to apply the soldering iron and the solder
separately to the joint, rather than the solder being applied
direct to the iron. When sufficient solder is applied, the solder
wire is removed. When the surfaces are adequately heated, the
solder will flow around the joint. The iron is then removed from
the joint.
protective coating 保护涂层
Common Types of Soldering
Defects
Pin/Blow Hole 铸件气孔
Bulbous Joint 球状焊点
Cracked Joint 裂缝焊点
Lifted Component
Flux Residues
Incomplete Joint 未焊透
Inconsistent or Poor Hole Fill
填充不均或不良
Joint Contamination
Lifted Pads 焊点剥离
Lifted Resist
Pad Contamination
Poor Solderability/Wetting
焊锡性不良
Poor Penetration 未焊透
Outgassing 脱气、排气
Solder Ball/Balling 焊锡球
Solder Flags 焊旗
Solder Shorts 焊接短路
Solder Skip 缺锡
Sunken Joint 接缝凹陷
Mask Discoloration 面罩褪色
不错的句子：
This could cause a variety of solder
defects, ranging from solder balling to non-wetting to damaged
devices to voiding to charred residues.
这样会产生许多焊接缺陷，诸如锡球、润湿不良、破坏元器件、空洞、碳化等。
Solder paste residues, which remain
in fine-pitch apertures after manual cleaning, cause inconsistent
print images and thus can lead to bridges and solder balling
between solder joints.
手工清洗后，残留在网板细间距开口中的焊锡膏会造成印刷图形不连续，从而发生桥接和焊点之间的焊球。
参考：
1.
英文网站，图文并茂：https://learn.adafruit.com/adafruit-guide-excellent-soldering/common-problems
2. soldering defects
焊接缺陷，英文网站，图文并茂：http://www.epectec.com/pcb/wave-soldering-defects/
3.
SMT常用英语单词：http://www.smt-ai.com/pddetailthree/tech/detail-376385.html
4.
如何用英语表达“虚焊”：http://bbs.smthome.net/read-htm-tid-94567-keyword-�麸.html
以下直接粘贴自其它网站，个人觉得还需要推敲，需要根据出现的地方转换词语属性：
焊锡工艺中的常用英文
Solding quality
1 空焊 Empty Solder
2 包焊 Excess
Solder
3 浮焊 Floating
Solder
4 冰柱 Icing
5 虚焊 Inveracious Soldering
6 掉件，漏件 Missing
Component
7 开路 Open
8 漏焊 Open Solder
9 锡桥 Solder Bridge
10 锡尖突出 Solder
Tip
11 锡裂 Split Solder
错件
Wrong Component
短路
Short
空焊
Open
锡未熔/冷焊
Cold Solder
折脚
Bended Pin
缺件
Missing Component
极反
Wrong Polarity
立碑
Tombstone
侧立
Side Up
位移/倾斜
Shift
助焊剂残留
Flux Pollution
零件脚翘
Raised Pin
翻面
Reserve component
锡不足 / 吃锡不良
Insufficient Solder/ Poor Solder
多件
Excess Commponent
浮件
Component Floating
溢锡
Flooded Solder
氧化
Oxidized
外观不洁
Surface Pollution
裁板不良
Router Defect
板弯
Board curved
重组 OK
OK after Reassembling
人为撞件/括伤/压伤/变形
Cracked Component/Scratched
组装不良
Assembling Fail
第一次烧录不良
First flash fail
测试点击穿
Test point breakdown
机板模组无法修复报废
Can't Be Repaired
复测ok
Retest ok
Wikipedia pages in category "Brazing and soldering"
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