0095-腐蚀、浸蚀、侵蚀；还是蚀刻_quantimet720金相技术

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0095-腐蚀、浸蚀、侵蚀；还是蚀刻

(2010-09-14 15:51:45)

腐蚀、浸蚀、侵蚀；还是蚀刻

金相样品的组织显示技术中，采用化学试剂与金属抛光面接触，在电化学原理作用下，显示组织结构的方法，如果命名的话，侵蚀、腐蚀、浸蚀，是国内最常用的几个词汇。他们的内涵在金相研究领域，完全是等同的，没有什么差异；从书籍、论文中的使用可以得出这一认识。

因为现代工业技术由西方传入，所以，要想明辨这些概念，重要的一个手法，就是看看西方工业国家是如何命名这些过程的。当然，选择美国文献，相信对于多数人，应该是可以得到认可的。

在Contrast Enhancement and Etching, Metallography and Microstructures, Vol 9, ASM Handbook, ASM International, 2004, p. 294–312中，有一个表格：Table 1 Definitions of etching methods，全文摘录如下：

	Method	Definition
1.	Anodic etching	Reveals the microstructure by selective anodic dissolution of the polished surface using a DC current. Variation with layer formation: anodizing
2.	Attack polishing	Simultaneous etching while mechanical polishing
3.	Cathodic etching	See ion etching.
4.	Cold etching	Reveals the microstructure at room temperature and below
5.	Controlled etching	Electrolytic etching with selection of suitable etchant and voltage, resulting in a balance between current and dissolved metal ions
6.	Crystal figure etching	Discontinuity in etching depending on crystal orientation. Distinctive sectional figures form at polished surface. Closely related to dislocation etching
7.	Deep etching	Macroetching, especially for steels, to determine the overall character of the material(presence of imperfections such as seam defects, rolling defects, forging bursts, remnant shrinkage voids, cracks, and coring)
8.	Dislocation etching	Reveals exit points of dislocations on the sample surface. Etching of dislocations is caused by their strain field ranging over a distance of several atoms. Crystal figures(etch pits) are formed at the exiting points. For example, etch pits for cubic materials are cube faced.
9.	Dissolution etching	Reveals the microstructure by surface removal
10.	Double etching	Two etchants are used sequentially, the second one will accentuate a particular microstructural feature.
11.	Drop etching	Placing a drop of an etchant on a selected area of the sample surface to develop the alloying microconstituents (drip reaction)
12.	Dry etching	Develops the microstructure by gaseous exposure
13.	Electrochemical (chemical etching)	General term for revealing the microstructure by redox reactions
14.	Electrolytic etching	See anodic etching.
15.	Etch rinsing	Pouring the etchant over a tilted sample surface until the structure is revealed. Used for etching with severe gas evolution
16.	Eutectic cell etching	Reveals eutectic grains (cells)
17.	Grain-boundary etching	Reveals the intersections of individual grains. Grain boundaries have a higher dissolution potential than the individual grains because of their high density of structural defects. Accumulation of impurities in grain boundaries increases this effect.
18.	Grain-contrast etching	Etching the surface of the grains according to their crystal orientation. They become distinct by the different reflectivity caused by reaction layers or surface roughness.
19.	Heat tinting	Formation of interference colors in air or other gases, usually at elevated temperature
20.	Hot etching	Development and stabilization of the microstructure at elevated temperature in etching solutions or gases
21.	Identification(selective) etching	Etching for the identification of particular microconstituents without attacking any others
22.	Immersion etching	The sample is immersed in the etchant with the polished surface up and is agitated. This is the most common etching method.
23.	Immersion etching (cyclic)	Alternate immersion into two etchants: 1, the actual etchant; 2, solution to dissolve the layer formed during the etching process of 1
24.	Ion etching	Surface removal by bombardment with accelerated ions in a vacuum (1 to 10 kV)
25.	Long-term etching	Etching times of a few minutes to several hours
26.	Macroetching	Reveals the macrostructure for the examination with the unaided eye or at a magnification of 50× or less
27.	Microetching	Reveals the microstructure for microscopic observation at a magnification of 50× or higher
28.	Multiple etching	A sample is etched sequentially with specific etchants to reveal certain constituents.
29.	Network etching	Formation of networks (subgrain boundaries), especially in mild steels after etching in nitric acid
30.	Optical etching	Develops the microstructure by using special illumination techniques (dark-field, phase contrast, interference contrast, polarized light)
31.	Physical etching	Develops the microstructure through removal of surface atoms or lowering the grain surface potential
32.	Plasma etching	High-frequency electromagnetic vibrations produce radicals in a gas mixture that react with the sample surface and cause its removal.
33.	Potentiostatic etching	Anodic development of the microstructure at a constant potential enables a defined etching of singular phases.
34.	Precipitation etching	Develops the microstructure by the formation of reaction products at the sample surface
35.	Primary etching	Develops the cast microstructures including coring
36.	Print etching(printing)	A carrier material is soaked with an etching solution and is pressed onto the sample surface. The etchant reacts with one of the microstructural constituents forming substances that affect the carrier material. The result is a direct imprint as a life-size image. It is used for the identification of specific elements, for example, sulfur.
37.	Secondary etching	Develops the microstructures that differ from primary structures through transformation and heat treatment in the solid state
38.	Segregation (coring) etching	Develops segregation (coring) mainly in macrostructures and microstructures of castings
39.	Short-term etching	Etching time of seconds to a few minutes
40.	Shrink etching	Produces a precipitate coating on the grain surfaces and shrinks upon drying, generating cracks. Crack orientation depends on the underlying crystal structure.
41.	Staining	Precipitation etching that causes contrast by distinctive staining of microconstituents; different interference colors originate from surface layers of varying thickness. Identifies inhomogeneities
42.	Strain etching	Reveals regions of high deformation within undeformed areas. Strained areas show increased segregations of precipitates.
43.	Swabbing	Wiping the sample surface with cotton saturated with the etchant; this will simultaneously remove undesired reaction products.
44.	Thermal etching	Annealing the specimen in a vacuum or inert atmosphere. This is a preferred technique for high-temperature microscopy and for ceramics.
45.	Wet etching	The sample surface has been wetted before immersion into the etching solution. This is important when using color etchants.
46.	Wipe etching	See swabbing.

Source: Ref 1

Reference cited in this section

1. G. Petzow, Metallographic Etching, 2nd ed., ASM International, 1999

一个基本的判断是：etching，是表述显示组织的技术手段的最重要的表达单词。在Wikipedia维基百科中，对于etching的解释，参看下面的文字。

Etching is the process of using strong acid or mordant to cut into the unprotected parts of a metal surface to create a design in intaglio in the metal (the original process—in modern manufacturing other chemicals may be used on other types of material). As an intaglio method of printmaking it is, along with engraving, the most important technique for old master prints, and remains widely used today.（http://en.wikipedia.org/wiki/Etching）

The Soldier and his Wife. Etching by Daniel Hopfer, who is believed to have been the first to apply the technique to printmaking

可以推断，金相研究中，使用etching，最初源于版画、印刷技术。这其中有一个重要的内涵就是：在特定材料的特殊处理的表面，出现一个预期的图案；图案有目的性的，所以必须是可控的。而金相研究中进行etching，也是希望得到可以观察的显微组织，而不仅仅是破坏。因此，在金相研究中的组织显示过程中，引入etching，确实引用得贴切。那么，如果从腐蚀、侵蚀、浸蚀等常见的国内“金相术语”中选择的话，哪个词更贴切？

首先，简单看看国内科研领域，是如何使用这3个词汇的。我们以期刊网上的检索结果来判断。

先说腐蚀。金相研究领域以外，腐蚀的概念是一种不希望发生的失效形式。比如，《13Cr钢油管腐蚀原因分析》中的“腐蚀”一词就具有代表性。对应的英文关键词是：corrosion（腐蚀、锈）。

Wikipedia维基百科中，对于corrosion有清楚地介绍，参见下文。

Corrosion is the disintegration of an engineered material into its constituent atoms due to chemical reactions with its surroundings. In the most common use of the word, this means electrochemical oxidation of metals in reaction with an oxidant such as oxygen. Formation of an oxide of iron due to oxidation of the iron atoms in solid solution is a well-known example of electrochemical corrosion, commonly known as rusting. This type of damage typically produces oxide(s) and/or salt(s) of the original metal. Corrosion can also refer to other materials than metals, such as ceramics or polymers, although in this context, the term degradation is more common.

In other words, corrosion is the wearing away of metals due to a chemical reaction.

（http://en.wikipedia.org/wiki/Corrosion）

下面是其页面展示的典型的corrosion事件。

Rust, the most familiar example of corrosion.

Volcanic gases have sped the corrosion of this abandoned mining machinery

Corrosion on exposed metal

如果单纯看金相研究过程中的“腐蚀”，比如，《化学腐蚀法研究Nd：YAG晶体位错》中的“化学腐蚀”，英文对应为：chemical etching。还有《金属铱金相试样的电解腐蚀》中的电解腐蚀，对应为：electrolytic corrosion。这样，对于金相中的“腐蚀”，国内选择了两个对应英语单词；corrosion的选择有些不妥。这也说明，金相研究中，使用“腐蚀”一词，是会引起歧义的。（实际上，我们现在所说的电解腐蚀，应该对应Electrolytic etching，或是Anodic etching）

对于浸蚀，从《大功率核电机组通流部分去湿及防浸蚀措施分析》可以看出，浸蚀也是一种不希望出现的破坏行为；对应的英文是erosion。如果参照Wikipedia维基百科，其选择的英文是不准确的；或者，中文因该改为“侵蚀”。

Erosion is the process of weathering and transport of solids (sediment, soil, rock and other particles) in the natural environment or their source and deposits them elsewhere. It usually occurs due to transport by wind, water, or ice; by down-slope creep of soil and other material under the force of gravity; or by living organisms, such as burrowing animals, in the case of bioerosion.（http://en.wikipedia.org/wiki/Erosion）

而，由《熔融锌对热镀锌沉没辊的浸蚀机理及对策》一文可知，作者认为浸蚀、腐蚀是一回事情。综合看，对于浸蚀，如果不是专门应用于金相研究方面，国内的认识，基本等同于腐蚀。

（化学）浸蚀应用于金相研究中，对应的英文有：corrosion、Chemical etching等。这也说明，国内对于“浸蚀”一词的认识并不统一；如果没有非常细致的态度，完全根据自己的理解，很容易就混同于“腐蚀”或是“侵蚀”。

来看“侵蚀”。有意思的是，在office word软件中，后台检查总是将“浸蚀”下面标出红色标识线，右键点击，一个小窗口会建议你将“浸蚀”改为“侵蚀”。侵蚀，通常看到的对应英文是：erosion。《全国侵蚀沟道普查指标及方法初探》一文，很好地说明了Wikipedia维基百科对于erosion的诠释。《RH浸渍管浇注料侵蚀机理的研究》一文可以看出，对于侵蚀的一般理解，也是一种不好的事情，不希望出现。

金相研究中，对于“侵蚀”的对应英文是：erosion、etching、etch等。可以说，依然存在不确定性。

有没有相对恰当的中文词可以对应etching？确实有！蚀刻。《金属精细蚀刻技术》一文可以看出，蚀刻的内涵包括了：有意识、可控，存在腐蚀现象。《仿金属蚀刻印刷工艺在卡类产品上的应用与制作》一文说明，蚀刻是印刷工艺过程中的词汇。《简单蚀刻法制备具有可控高度的金属纳米线阵列》一文显示了，蚀刻方法在人为实施过程中的可控性。

“蚀刻”一词，其英文对应国内非常统一：etching。

感觉，绕了一大圈，又回到了原来出发的地点。

Etch是“蚀刻”的动词；etchant是指蚀刻液，会说Additional tint etchants、chemical etchants。reagent是指试剂，会有膜出现；比如，Klemm's I reagent。

revealing：显示；比如，reveal the microstructure。

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