electrical component pin oxided電子零件不吃錫　        

SMT component up side　   側立　

PCB liniNG short　 PCB內層短路　        

electrical component open internally　 電子零件內部開路　         

peripheral parts shift and stone cause NTF　      週邊零件移位側立造成誤判　

PCB pad is dirty　 PCB pad贓污　         

passed by socket board verified but failed at 2rd on board f/t　 BGA二次上板NG　testiNG open for SMT cold solder　SMT component 冷焊導致ICT 測試 open　

PCB oxided damaged　       PCB銅綠斷線造成孔不良　            

MB repaired,component pendiNG verification 板子修好待驗證零件　          

DIP component reversed　   DIP製程零件反向　

PCB path open　  PCB線路斷線　        

parts oxidization　零件氧化　          

DIP missiNG component　    DIP製程未上零件　

PCB path short　  PCB線路短路　        

lower of impedance　   ICT測試阻抗值偏低,f/t和ort驗證ok　          

DIP wroNG component　     DIP製程上錯零件　

PCB pad oxided　 PCB pad不吃錫　      

SMT component reversed　  SMT製程零件反向　        

DIP excess object　     DIP製程異物介入製程　

PCB through hole broken　  PCB貫孔不通　        

SMT missiNG component　  SMT製程未上零件　        

DIP cold solder　  DIP製程焊接不確實　

PCB solderiNG (golden fiNGer)　 PCB金手指沾錫　            

SMT wroNG component　    SMT製程上錯零件　        

DIP solderiNG short　   DIP製程焊錫短路　

PCB (golden fiNGer)　  PCB 金手指沾膠　           

SMT excess object　    SMT製程異物介入製程　        

DIP solderiNG (golden fiNGer)　  DIP製程金手指沾錫　

PCB BGA though　      PCB BGA 貫孔露銅　       

SMT solderiNG short　  SMT製程焊錫短路　        

DIP component incline　      DIP製程零件加工歪斜　

colden fiNGer be scratched　      金手指刮傷　            

SMT solderiNG (golden fiNGer)　 SMT製程金手指沾錫　            

DIP component float　  DIP製程零件加工浮件　

golden fiNGer is dirty　  金手指髒污　            

SMT component shift　 SMT製程零件置件移位　        

DIP component bent lead　  DIP製程零件跪腳　

mec component bad　  機構零件本體不良　         

SMT tombstone　  SMT製程立碑　               

DIP制程溢錫或溢錫短路　

mec component short　機構零件內部短路　         

SMT component tilt lead　   SMT製程零件翹腳　        

DIP missiNG label　      DIP製程缺標簽　

mec component pin oxided　      機構零件不吃錫　            

SMT wroNG location　  SMT製程上錯位置　        

DIP wroNG location　   DIP製程上錯位置　

electrical component bad　  電子零件本體不良　         

SMT rework NG　  SMT維修不良　        

DIP cold solder　  DIP制程冷焊　

electrical component short　電子零件內部短路　         

SMT insufficient solder　      SMT 制程少錫　        

DIP insfficent solder　   DIP 制程錫少　

psg　     壓件　         

SMT component up side down　  SMT 零件反貼　        

DIP component excess solder　  DIP 制程零件錫過飽　

SMT excess solder　    多錫　         

SMT cold solder　 SMT 制程冷焊　        

DIP solder ball　    DIP制程錫珠　

PCB pad damaged　    撞件造成PCB掉pin　      

fm radio can not catch a clear channel　    fm radio抓不到清晰頻道　 

device no find　    找不到光碟機(測試程試不運行)　

pdj　connecter 被治具插壞　          

set rma to repair　 轉rma維修　      

drive initialize failure　   光碟機初始化失敗　

test missiNG label　      測試缺標簽　            

component damaged　 零件受外力撞擊破裂,斷腳　           

inside transfer rate fail　 內軌傳輸率在測試中失敗　

pack component reversed　 包裝零件反向　         

component burned　    零件燒毀　         

transfer rate too low　   最大傳輸率在測試中失敗　

pack component incline　    包裝零件加工歪斜　         

PCB path burned　      PCB線路燒斷　        

"random stroke ,any access time at once over or failure"　      "隨機行程,任單一次access失敗或超過時間"　

pack missiNG component　  包裝未上零件

PCB path broken　      PCB外力造成之斷線　            

"full stroke ,any access time at once over or failure"　     

"全沖程,任單一次access失敗或超過時間。"　

pack wroNG component　    包裝上錯零件　         

PCB path short　  PCB外力造成之短路　            

inside transfer rate too low　 內軌傳輸率太慢　

pack missiNG label　    包裝缺標簽　            

component bent lead　 客戶更動零件跪腳 (不含廠內)　           

transfer rate too low　   最大傳輸率太慢　

rework　更動線路或零件　       

component reversed　  客戶將零件插反 (不含廠內)　        

random stroke average time over or failure　      隨機沖程平均 時間失敗或超時　

clear cmos　  清除cmos資料　       

component tilted　 零件受外力撞擊歪斜　            

"full stroke ,access time too low"　     "全行程,平均讀取時間太慢"　

last time t/r fail　   前次維修造成失效　         

lossiNG component　   零件掉失　         

jitter test NG　      jitter 測試測試值超出規格　

cmos rtc timiNG delay　cmos 時間延遲　       

wroNG component　    客戶自行換錯零件　         

button no function　     按鍵無作用　

socket pin deformation　      腳座擴孔變形　         

excess object　    外來異物介入　         

connect gpib fail　 連接gpib 失敗　

re- assemble machine ok　  重新組裝ok　           

wroNG jumper settiNG　       排針設定錯誤　         

can not initialize power meter　    不能初始化power　meter　

re-assemble lcm ok　   lcm 重新組裝ok　            

wroNG cmos setup　    cmos設定錯誤　       

output read power error　     輸出讀功率錯誤　

other ,replace board　  其它原因交換面板測試ok　           

damaged by user　      嚴重損壞,不予維修　        

output write power 1 error　  輸出寫功率1錯誤　

capacitor brief short　   電容瞬間短路　         

out of warranty　   超過保固期,已無零件替換　           

output write power 2 error　  輸出寫功率2錯誤　

DIP circuit test fall　     DIP 電流測試不良　         

update bios　 更新bios版本　        

output overdriver write power 1 error　 輸出最大功率1錯誤　

customer induced defect　   客戶要求重工導致的不良　            

reflash bios　 重燒bios資料　        

output overdriver write power 2 error　 輸出最大功率2錯誤　

DIP current test fail　    DIP 電流測試不良　         

no component, chaNGe m/b　    保固內,無零件,交換機板　       

led no bright or led bright abnormal　   led燈不亮或燈亮異常　

waive material　    特採零件　          set rma to repair　 轉rma維修　pick-up to hit the spindle motor　      pick-up撞擊spindle motor　

component bad for consign material　 客戶指定使用零件不良　

defect　  報廢　                    pick-up sled home action　 pick-up不動　

repair determinant as component bad but no socket board test wait test component　    維修判定為BGA不良但沒有用socketboard待驗證的零件　 

set rma to repair　轉rma進行維修　       

key read power 1 fail　 調整讀功率 1失敗　

DIP crystal test fall　     DIP 晶振測試不良　         

refresh firmwire　   重新刷分位　            

key read power 2 fail　 調整讀功率 2失敗　

no ready for CD-rom disc　CD-rom碟不讀　         

forward　       向前傾斜　         

key write power 1 fail　 調整寫功率1失敗　

no ready for CD-r disc　      CD-r碟不讀　           

backward　    向後傾斜　         

key write power 2 fail　 調整寫功率2失敗　

no ready for CD-rw disc　    CD-rw碟不讀　         

sideways　    向側面傾斜　             run in time out　    run in時間過長　

DIP solder over flow ( short )　   DIP製程溢錫或溢錫短路　       

broken　 斷掉　                      CD-r write speed fail　CD-r寫入速度失敗　

no problem found　      一切正常　   bent up　      彎屈　         

data compare fail　      數據比對失敗　

ICT fault alarm　    ICT測試誤判　          

socket t mode 1 failure　     socket t 模式一外觀不良　      

opc(optimum power control) fail　      最佳功率校正錯誤　

component passed socket board test for initial verification　     母板驗證零件為良品　socket t mode 2 failure　      socket t 模式二外觀不良　      

a normal write error which can improve immediately　一般性可立即恢復的錯誤　

the qfp was NG but test ok with a new qfp replaced,then re-board the NG qfp on the same PCBA and the failed symptom disappeared.　      維修將判定為不良的qfp零件拖錫後不良現象依舊，更換新的零件測試ok,但將不良零件重新焊接到原來的產品後不良現象消失　         

socket t mode 3 failure　     socket t 模式三外觀不良　      

CD-rw write speed fail　       CD-rw寫入速度失敗　

ebt fail　 ebt 測試fail後需測試16x　           

socket t mode 4 failure　     socket t 模式四外觀不良　      

DIP power test fall　     DIP 電壓測試不良　

gpu/memory failure for n2 model　      n2機種gpu或memory 不良　  

socket t mode 5 failure　     socket t 模式五外觀不良　

rd design issue　   設計問題　

audio waveform error　音頻波形異常　          

tray automatic trayin/out　   tray盤自動進出　

model name error　      model name錯誤　

audio no output　  無音樂輸出　            

tray in/out noise　 tray盤自動進出異音　      

play audio error　  播放音樂失敗(喇叭輸出音量不正常)　

siNGle waveform　 單波　         

tray out fail　 tray盤不出　      

line out out put error　  line out 聲音輸出不良(示波器輸出不正常)　

siNGle voice　      單音　         

tray in fail　   tray盤不進　      

firmware error　     韌體版本不正確　

output audio noisy　    輸出音樂有雜音　            

tray in/out time out of spec　      tray盤進出緩慢　      

fly disc　 tray盤出來時碟片還在轉動　

volume knob not rotatiNG smoothly　  音量開關旋轉不順　         

write rate low than spec　    寫入速度不符合參考檔設定　         

writ verify c1/c2　 燒錄完畢後比對c1orc2過大　

volume knob rotation audio noisy　    音量旋轉時輸出音樂雜音　            

writ date verify error　   寫入資料比對有錯