AEC-Q100标准解读之预处理Precondition Test (PC)，参考标准，目的及试验条件。

试验项目：Precondition Test (PC)

参考标准：JEDEC J-STD-020 、JESD22-A113； 

目的：模拟IC在使用之前在一定湿度，温度条件下存储的耐久力，也就是IC从生产到使用之间存储的可靠性；

失效机制：封装破裂，分层；

试验通过判断依据：芯片试验完成后FT常温测试pass、超声扫描结果pass；

实验室能力范围：可以做MSL4到MSL1任意等级的PC；

Performed on surface mount devices only. PC performed before THB/HAST, AC/UHST, TC, and PTC stresses. It is recommended that J-STD-020 be performed to determine what preconditioning level to perform in the actual PC stress per JA113. The minimum acceptable level for qualification is level 3 per JA113. Where applicable, preconditioning level and Peak Reflow Temperature must be reported when preconditioning and/or MSL is performed. Delamination from the die surface in JA113/J-STD-020 is acceptable if the device passes the subsequent Qualification tests. Any replacement of devices must be reported. 

TEST before and after PC at room temperature.

需求确认：需客户确认试验的MSL等级。

目前国内PC试验大部分都是按照J-STD-020 里面的MSL 3要求做的