Electrical(电气规则)
Clearance(安全间距规则)
short-circuit(短路规则)
Unrouted
Net(未布线网络规则)
Unconnected
Pin(未连线引脚规则)
Routing(走线规则)
Width(走线宽度规则)
Routing
Topology(走线拓扑布局规则)
Routing
Priority(布线优先级规则)
Routing
Layers(板层布线规则)
Routing
Corners(导线转角规则)
Routing Via
Style(布线过孔形式规则)
Fanout
Control(布线扇出控制规则)
SMT(表贴焊盘规则)
SMD To
Corner(SMD焊盘与导线拐角处最小间距规则)
SMD To
Plane(SMD焊盘与电源层过孔最小间距规则)
SMD
Neck-Down(SMD焊盘颈缩率规则)
Mask(阻焊层规则)
Solder Mask
Expansion(阻焊层收缩量规则)
Paste Mask
Expansion(助焊层收缩量规则)
Plane(电源层规则)
Power Plane
Connect(电源层连接类型规则)
Power Plane
Clearance(电源层安全间距规则)
Polygon
Connect Style(焊盘与覆铜连接类型规则)
Testpoint(测试点规则)
Testpoint
Style(测试点样式规则)
Testpoint
Usage(测试点使用规则)
Manufacturing(电路板制作规则)
Minimum
Annular Ring(最小包环限制规则)
Acute Angle
Constraint(锐角限制规则)
Hole
Size(孔径大小设计规则)
Layer
Pairs(板层对设计规则)
Highspeed(高频电路规则)
Parallel
Segment(平行铜膜线段间距限制规则)
Length(网络长度限制规则)
Matched Net
Lengths(网络长度匹配规则)
Daisy Chain
Stub Length
(菊花状布线分支长度限制规则)
Vias Under
SMD(SMD焊盘下过孔限制规则)
Maximum Via
Count(最大过孔数目限制规则)
Placement(元件布置规则)
Room
Definition(元件集合定义规则)
Component
Clearance(元件间距限制规则)
Component
Orientations(元件布置方向规则)
Permitted
Layers(允许元件布置板层规则)
Nets To
Ignore(网络忽略规则)
Hight(高度规则)
Signal Integrity(信号完整性规则)
Signal
Stimulus(激励信号规则)
Overshoot-Failing Edge(负超调量限制规则)
Overshoot-Rising Edge(正超调量限制规则)
Undershoot-Falling Edge(负下冲超调量限制规则)
Undershoot-Rising Edge(正下冲超调量限制规则)
Impedance(阻抗限制规则)
Signal Top
Value(高电平信号规则)
Signal Base
Value(低电平信号规则)
Flight
Time-Rising Edge(上升飞行时间规则)
Flight
Time-Falling Edge(下降飞行时间规则)
Slope-Rising
Edge(上升沿时间规则)
Slope-Falling Edge(下降沿时间规则)
Supply
Nets(电源网络规则)
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